Camstar’s InSite | Semiconductor TAP Edition for Test, Assembly and Packaging

Manufacturing Execution Systems (MES) of the past were created to fulfill the needs of the FABs. The Assembly and Test factories had to ‘make do’ with software that was not really designed to their specifications. Realizing this need, Camstar introduced an MES solution tailored to meet the requirements of the Semiconductor Test, Assembly and Packaging (TAP) industry.

What does InSite MES Offer?

Ask yourself a few questions about your existing processes.

• Can my MES software tell me exactly where I have production issues?
• Can my MES tell me which operators are in need of training?
• Can my MES differentiate between data coming from a tool that is working properly and one that is in need of preventative maintenance?
• Does my MES add value to my operations, or is it a burden on manufacturing?
• Does my MES system make me enter the same information twice?
• Does my MES “plug-in” to my ERP system or does it rely on cumbersome manual entry or file transfers?
• Does my MES help me capture information directly from the equipment?
• Does my MES integrate with equipment that does not use automation?
• Can my MES help me get the same kind of information without expensive cell-control software and with a minimal impact on the operator?
• Can my MES change with the times without having to hire costly consultants and programmers?
• Does my MES use Web-based technology such that my customers and my vendors can contribute to the flow of information and have access from anywhere in the world?

InSite | Semiconductor TAP Edition can do all of this and more!

A Traditional MES Problem:

Take the example of the wire bond step. In a traditional MES system, the lot moves into an operation and then moves out. All you can record is the tool in use and the operator doing the work. Material control and component issues are done at the lot level.

Let’s say 3 wire bonders are used to process a single lot through wire bond, each run by a different operator.

• Which operator do you associate with the lot?
• How will you know which operators are doing well and which ones need training?
• Which wire bonder is processing the parts? Which one will get recorded in the MES?
• Which spool of gold wire is being issued to the assembly lot?
• What if it is defective? Which parts need to be recalled?
• If wire pull tests are done, which machine is recorded as the source of this information?
• How will the engineers know which tool needs preventative maintenance?
• How will that help the engineers detect issues with the other equipment that didn’t get recorded?

Traditional MES solutions cannot answer these questions.

The InSite | Semiconductor TAP Edition Way:

What makes InSite | Semiconductor TAP Edition so special?

Current MES Technology

InSite | Semiconductor TAP Edition is an Object Oriented, fully scalable system that uses Web Services for the user interface. The architecture is founded upon Microsoft technology. Some MES systems claim to be object oriented but still require database managers to add tables and columns to extend the data model. InSite uses its unique Designer tool to extend and add objects to the solution. Not only can the data model be extended but Configurable Logic Flows (CLFs) can be used to add server-side logic to the model without programming. Data mappings can transfer information from data objects and the services that process them to completely eliminate the need to write client-side code. The new Web-Services provide complete web-based thin-client access to the InSite | Semiconductor TAP Edition via the Internet.

Adaptability
Whether the factory is a small R&D line or a major production facility InSite | Semiconductor TAP Edition can handle the workload with near instantaneous response time. Transaction rates in excess of 44 per second were recorded at the Microsoft test facility. Layered on top of the InSite product, the InSite |Semiconductor TAP Edition addresses the specific needs of the Semiconductor industry while retaining the flexibility of the InSite architecture. When the system is originally deployed at the factory, 80 to 95% of the requirements are satisfied ‘out of the box’. The remaining portion is configured based upon local requirements using the Modeler and Designer tools in InSite. It is an easy matter to extend existing objects to include site-specific data and you can even create your own objects, services and logic using the Designer such that any information requirements can be accommodated without programming. Using .Net and Web Services the user interfaces can be quickly tailored to the local environment including multi-lingual and double-byte character support.

Protection of your Investment
Since InSite | Semiconductor TAP Edition runs using Web Services it is not necessary to replace existing workstations that may already populate the manufacturing line. A philosophy of integration rather than replacement allows you to keep local systems and using XML connect them to InSite to retain the investment in the software while taking advantage of the latest technology.

Resource/Equipment Tracking
Semiconductor assembly and test process is unusual in that it requires operations (like Wire-Bond) where many tools can be used on a single lot at the same time. The situation becomes even more complex when a single piece of equipment (like a burn-in oven) may be used to process many lots at the same time. The InSite | Semiconductor TAP Edition allows a Many-to-Many relationship between tools and lots in process.
SPC/Data collection – the collection of data and Statistical and Process Control information, is built in to the solution. Action plans can be created such that operators/engineers can be automatically notified BEFORE equipment goes out of spec saving valuable time and product. Data collections can be specific to the tool, allowing engineers to receive more accurate, more timely information when it is needed, not after the fact.

Equipment Automation
Like semiconductor FABs, the test and assembly equipment may require automation; however, many of the factories are also heavily dependent upon manual entry. They need a user-friendly system that can capture a maximum of useful processing information with minimal operator input. InSite |Semiconductor TAP Edition integrates with the Cell Control layer of software to connect the tools to the MES system without requiring double entry of data and allowing the equipment to take advantage of InSite’s ability to store and manage manufacturing recipes and bills of material.

Integrated Material Tracking
InSite | Semiconductor TAP Edition tracks multiple types of material at a single step including the complex situation of multi-die devices. Each type of component is validated against the material lot it comes from to make sure that the right material is issued at the right time. This kind of automatic recipe validation is a standard feature of the InSite | Semiconductor TAP Edition.

EXAMPLE:

Factory X manufactures devices with two chips per device. Chip 1 is an emitter and Chip 2 is a receiver. In order to properly account for the manufacture of each device 2 chips go in but only one device comes out. How to account for this without looking like quantity is lost? How do you insure that the proper chip is mounted in each location? How do you track yield for each component?
One way to model this would be to define a bill of material at the die attach step where each chip and the substrate are components of the new device.

Using InSite | Semiconductor TAP Edition this is a simple situation to model and track. The bill of material (BOM) for the new device lists Chip 1, Chip 2, and the substrate as components to be issued at the Die Attach step in the workflow. At this step the operator sees a screen showing the setup for the die attach tool requiring the proper die lot for Chip 1, another lot for Chip 2 and a third lot for the substrate. Upon the construction of new devices the issuing of components from each of these lots takes place automatically including the accounting of any scrap and adjustments during processing. The operator simply records the number of new devices produced